Publication database

The growing demand for flexible, high-quality fabrication of free-form micro-optics drives the development of laser-based fabrication techniques for both the shape formation and surface polishing of optical elements. In this paper, we performed a thorough and systematic study on fused silica glass ablation using 10 ps and 320 fs duration pulses. Ablation processes for both pulse durations were optimized based on the measurements of the removed material layer thickness and surface roughness, and by analyzing the topographies of ablated cavities to remove material layers as thin as possible with minimum surface damage. Our findings demonstrate higher process resolution and surface quality for femtosecond pulses. Ablation of pre-roughened glass reduced the minimal removable glass layer thickness well below the 1 μm mark for both pulse durations, improving the process resolution. The minimal removable glass layer thickness was 14 times smaller for the femtosecond pulses, with up to 4.5 times lower surface roughness compared to samples processed with picosecond pulses. On the other hand, results revealed faster glass removal rates with picosecond pulses. In the end, arrays of microlenses were fabricated with both pulse durations and subsequently polished with a CO2 laser. Results revealed higher performance of microlenses fabricated with femtosecond pulses, providing better focusing capabilities and lesser beam scattering. Finally, this study demonstrated the successful fabrication of free-form optical elements with femtosecond and picosecond pulses, demonstrating the versatility and the potential of laser-based techniques.

Utilisation of high-power ultrafast laser for ablation-based industrial processes such as milling, drilling or cutting requires high production rates and superior quality. In this paper, we demonstrate highly efficient, rapid and high-quality laser micro-machining of three industrial metals (aluminium, copper, and stainless steel). Our proposed optimisation methods of pulse energy division in time result in simultaneous enhancement of ablation efficiency (volume per energy) and ablation rate (volume per time) while maintaining a focused laser beam on the target surface and high resolution. A high-tech femtosecond burst laser, producing laser pulses of τ = 350 fs duration and intra-burst repetition rates of f_P = 50 MHz, was employed in the experiments. Due to the utilisation of bursts, material removal efficiency and removal rate were increased by 18.0 %, 44.5 %, and 37.0 % for aluminium, copper, and stainless steel if compared with the best performance of single-pulses. In addition to the high processing rate, processing by burst mode resulted in lower surface roughness. This technique is believed to be a solution enabling extremely high femtosecond laser powers for precise microfabrication.

The cutting quality and strength of strips cut with femtosecond-duration pulses were investigated for different thicknesses of borosilicate glass plates. The laser pulse duration was 350 fs, and cutting was performed in two environments: ambient air and water. When cutting in water, a thin flowing layer of water was formed at the front surface of the glass plate by spraying water mist next to a laser ablation zone. The energy of pulses greatly exceeded the critical self-focusing threshold in water, creating conditions favorable for laser beam filament formation. Laser cutting parameters were individually optimized for different glass thicknesses (110–550 µm). The results revealed that laser cutting of borosilicate glass in water is favorable for thicker glass (300–550 µm) thanks to higher cutting quality, higher effective cutting speed, and characteristic strength. On the other hand, cutting ultrathin glass plates (110 µm thickness) demonstrated almost identical performance and cutting quality results in both environments. In this paper, we studied cut-edge defect widths, cut-sidewall roughness, cutting throughput, characteristic strength, and band-like damage formed at the back surface of laser-cut glass strips.

Water-assisted ultrashort laser pulse processing of semiconductor materials is a promising technique to diminish heat accumulation and improve process quality. In this study, we investigate femtosecond laser ablation of deep trenches in GaAs, an important optoelectronic material, using water and ambient air environments at different laser processing regimes. We perform a comprehensive analysis of ablated trenches, including surface morphological analysis, atomic-resolution transmission electron microscopy imaging, elemental mapping, photoluminescence, and Raman spectroscopy. The findings demonstrate that GaAs ablation efficiency is enhanced in a water environment while heat-accumulation-related damage is reduced. Raman spectroscopy reveals a decrease in the broad feature associated with amorphous GaAs surface layers during water-assisted laser processing, suggesting that a higher material quality in deep trenches can be achieved using a water environment.

Bio-inspired surfaces are able to decrease friction with fluids and gases. The most recognizable are shark-skin-like riblet surface structures. Such bio-inspired surfaces can be formed by the laser ablation technique. In this work, bio-inspired riblet surfaces with grooves were formed using picosecond ultraviolet laser ablation on pre-heated polytetrafluoroethylene (PTFE) at various sample temperatures. The ablation of hot PTFE was found to be 30% more efficient than the conventional laser structuring at the room temperature. The friction of structured PTFE surfaces with the flowing air was investigated by using drag a measurement setup. Results show the decrease of friction force by 6% with dimensionless riblet spacing around 14–20.

The optical performance of high-resistivity silicon with a laser-ablated surface was studied in the transmission mode in the frequency range of 0.1-4.7 THz. A reciprocal relationship between the transmission brightness and the surface roughness was observed at discrete THz frequencies. The measured dispersion was reproduced by the THz wave scattering theory using an effective refractive index model. No significant differences between the samples processed either with psor ns-duration laser pulses in ambient air or in argon enriched atmosphere were found in the THz regime. It was demonstrated that the majority of optical losses of the silicon with the laser modified surface were due to the scattering of THz waves and not due to the absorption in silicon-compounds formed during the laser ablation.

Solid-state lasers with pulse duration of 10 ps and radiation wavelength of 1064 nm were used to investigate the laser ablation efficiency dependence on processing parameters: laser fluence (pulse energy and beam spot size), beam scanning speed, pulse repetition rate, and scanned line (hatch) distance for the copper sample. Utilising a 40 W power laser, the highest ablation efficiency of 2.5 µm³/µJ and the ablation rate of 100 µm³/µs with the smallest surface roughness of 0.2 µm was obtained. Three-dimensional (3D) fabrication using a galvanometer scanner and layer-by-layer removal technique with optimal parameters defined for efficient ablation were demonstrated at a rate of 6 mm³/min. Combination of high material removal rate with excellent quality and complex 3D structure formation is in a high interest for mimicking bio-inspired surfaces, micro-mould fabrication and decorative applications.

In this paper, we investigate the local oxidation of titanium thin films under the action of picosecond laser pulses. Periodical structures were recorded by the multi-beam interference scheme utilizing various numbers of laser beams, and the relationship between spatial resolution and the contrast of the structures was studied. The Raman spectra of the laser processing regions confirmed the oxidation even under the action of a single picosecond pulse. An analytical simulation of titanium film oxidation in the interference field was provided, and obtained results are correlated with the experimental data. The results of theoretical modeling show that the thermochemical effects of picosecond laser pulses allow recording periodic structures with a period of 0.65 lines per μm. The demonstrated results are important in the adaptation of technological laser systems for the manufacture of diffractive optical elements.

We present a compact diffractive silicon-based multilevel phase Fresnel lens (MPFL) with up to 50 mm in diameter and a numerical aperture up to 0.86 designed and fabricated for compact terahertz (THz) imaging systems. The laser direct writing technology based on a picosecond laser was used to fabricate diffractive optics on silicon with a different number of phase quantization levels P reaching an almost kinoform spherical surface needed for efficient THz beam focusing. Focusing performance was investigated by measuring Gaussian beam intensity distribution in the focal plane and along the optical axis of the lens. The beam waist and the focal depth for each MPFL were evaluated. The influence of the phase quantization number on the focused beam amplitude was estimated, and the power transmission efficiency reaching more than 90% was revealed. The THz imaging of less than 1 mm using a robust 50 mm diameter multilevel THz lens was achieved and demonstrated at 580 GHz frequency.

Laser interference ablation in silicon using femto-, pico-, and nanosecond pulses was investigated. The experimental and computational results provide information about nanoscale thermal diffusion during the ultra-short laser–matter interaction. The temperature modulation depth was introduced as a parameter for quality assessment of laser interference ablation. Based on the experiments and calculations, a new semi-empirical formula which combines the interference period with the laser pulse duration, the thermal modulation depth and the thermal diffusivity of the material was derived. This equation is in excellent agreement with the experimental and modelling results of laser interference ablation. This new formula can be used for selecting the appropriate pulse duration for periodical structuring with the required resolution and quality.