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The cutting quality and strength of strips cut with femtosecond-duration pulses were investigated for different thicknesses of borosilicate glass plates. The laser pulse duration was 350 fs, and cutting was performed in two environments: ambient air and water. When cutting in water, a thin flowing layer of water was formed at the front surface of the glass plate by spraying water mist next to a laser ablation zone. The energy of pulses greatly exceeded the critical self-focusing threshold in water, creating conditions favorable for laser beam filament formation. Laser cutting parameters were individually optimized for different glass thicknesses (110–550 µm). The results revealed that laser cutting of borosilicate glass in water is favorable for thicker glass (300–550 µm) thanks to higher cutting quality, higher effective cutting speed, and characteristic strength. On the other hand, cutting ultrathin glass plates (110 µm thickness) demonstrated almost identical performance and cutting quality results in both environments. In this paper, we studied cut-edge defect widths, cut-sidewall roughness, cutting throughput, characteristic strength, and band-like damage formed at the back surface of laser-cut glass strips.

The ultrashort laser processing of the cutting tools and cutting inserts from tungsten carbide, ceramic and metal composites (CERMET), and polycrystalline diamond materials was demonstrated, and the ablation rates of mentioned ultra-hard materials were evaluated for a laser wavelength of 1064 and 532 nm. The optimal processing throughput was estimated. Laser manufacturing was performed with the five-axis computer numerical control (CNC) machine and scanner for beam translation with the high speed and the ultrashort ∼12 ps pulse duration high repetition rate laser source. The systematic approach was implemented in an experimental variation of process parameters that play a significant role in processing quality. By varying the laser fluence, pulse overlap, and layers’ count, different material removing rates can be achieved from 300 nm/layer to ∼18 μm/layer. The submicrometer removing rate involves a high precision control of the structure depth. It was demonstrated that only by a minor change of the processing parameters, the surface roughness of the material could be minimized down to Ra < 300 nm. Rough and smooth processing can be combined to optimize the structure processing throughput.