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In this paper, we investigate the laser processing of the CIGS thin-film solar cells in the case of the high-speed regime. The modern ultra-short pulsed laser was used exhibiting the pulse repetition rate of 1 MHz. Two main P3 scribing approaches were investigated – ablation of the full layer stack to expose the molybdenum back-contact, and removal of the front-contact only. The scribe quality was evaluated by SEM together with EDS spectrometer followed by electrical measurements. We also modelled the electrical behavior of a device at the mini-module scale taking into account the laser-induced damage. We demonstrated, that high-speed process at high laser pulse repetition rate induced thermal damage to the cell. However, the top-contact layer lift-off processing enabled us to reach 1.7 m/s scribing speed with a minimal device degradation. Also, we demonstrated the P3 processing in the ultra-high speed regime, where the scribing speed of 50 m/s was obtained. Finally, selected laser processes were tested in the case of mini-module scribing. Overall, we conclude, that the top-contact layer lift-off processing is the only reliable solution for high-speed P3 laser scribing, which can be implemented in the future terawatt-scale photovoltaic production facilities.

Cu-chalcopyrite based solar cells such as Cu(In,Ga)Se₂ (CIGS) have been established as the most efficient thin-film technology in converting sunlight into electricity. Laser scribed monolithic interconnects are one of the key technologies which will play a significant role in future develop-ments of CIGS technology. Laser scribing is needed to maintain module efficiency by dividing large scale device to smaller cells interconnected in series. CIGS layer is a thermally sensitive material, and laser modification can induce local structural changes of the active layer and significantly modi-fy the electrical properties. Therefore, the laser modified region can act as series interconnect be-tween the adjacent cells. In this study, we investigated the laser modification of the CIGS active layer with picosecond laser. The EDS analysis revealed the increase of Cu/(In+Ga) ratio in laser treated areas while Raman measurements indicated changes in main CIGS peak and formation of the Cu-rich CuGaSe₂ phase. Therefore, this resulted in significant electrical conductivity increase in laser-treated areas. Electrical testing of the laser performed P2 micro-welds showed scribe conduc-tivities up to 9.3 Ω·cm which are acceptable for the cell serial interconnection.

Cu-chalcopyrite based solar cells, such as Cu(In,Ga)Se₂ (generally called CIGS) have been established as the most efficient thin-film technology in converting sunlight into electricity. High efficiency, flexibility and small weight make this technology attractive for future developments. Large scale production of these devices requires innovative technological solutions including the laser scribed monolithic interconnects. Laser scribing is needed to maintain module efficiency by dividing large scale device to smaller cells interconnected in series. Serious challenges in laser scribing technology have to be solved, including the laser induced thermal modification of the CIGS absorber layer. CIGS layer is thermally sensitive material, and laser modification can induce local structural changes and phase transitions to the metallic state. That is undesirable for the P3 scribing since superior isolating properties are needed. However, this effect can be used for the P2 process – interconnection of the adjacent cells. In this study, we investigated the picosecond laser modification of the CIGS active layer to form the series interconnect. The P2 laser process was optimized relying on the scribe electrical resistivity measurements with the best value of 3.5 Ω·cm. The EDS analysis revealed the increase of Cu/(Ga + In) ratio in laser treated areas while Raman measurements indicated changes in main CIGS peak and the formation of the Cu-rich CuGaSe₂ phase. Therefore, this resulted in a significant electrical conductivity increase in laser-treated areas which is acceptable for the cell serial interconnection.