FemtoLux 30

Industrial Femtosecond Laser
  • 30 W at 1030 nm, 11 W at 515 nm
  • >90 µJ at 1030 nm, >50 µJ at 515 nm
  • MHz, GHz burst modes
  • < 350 fs – 1 ps
  • Single shot to 4 MHz (AOM controlled)
  • Dry cooling (no water used)
  • 30 W at 1030 nm, 11 W at 515 nm
  • >90 µJ at 1030 nm, >50 µJ at 515 nm
  • MHz, GHz burst modes
  • < 350 fs – 1 ps
  • Single shot to 4 MHz (AOM controlled)
  • Dry cooling (no water used)

Features & Applications


  • Typical max output power
    30 W at 1030 nm,
    11 W at 515 nm
  • >90 µJ at 1030 nm,
    >50 µJ at 515 nm
  • MHz, GHz burst modes
  • >250 µJ in a burst mode
  • <350 fs – 1 ps
  • Single shot to 4 MHz (AOM controlled)
  • <0.5% RMS power long term stability over 100 hours
  • M² < 1.2
  • Beam circularity > 0.85
  • Zero maintenance
  • Dry cooling (no water used)
  • PSU and cooling unit integrated into single 4U rack housing
  • Easy and quick installation
  • Compatible with galvo and Polygon scanners as well as PSO controllers
  • 2 years of total warranty


  • LCD, LED, OLED drilling, cutting and repair
  • Microelectronics manufacturing
  • Glass, sapphire and ceramics micro processing
  • Glass intra volume structuring
  • Micro processing of different polymers and metals



The FemtoLux 30 femtosecond laser has a tunable pulse duration from <350 fs to 1 ps and can operate in a broad AOM controlled range of pulse repetition rates from a single shot to 4 MHz.

The maximum pulse energy is more than 90 μJ operating with single pulses and can reach 250 µJ in burst mode, ensuring higher ablation rates and processing throughput for different materials.

The FemtoLux 30 beam parameters will meet the requirements of the most demanding materials and micro-machining applications.

Innovative laser control electronics ensure simple control of the FemtoLux 30 laser by external controllers that could run on different platforms, be it Windows, Linux or others using REST API commands.

This makes easy integration and reduces the time and human resources required to integrate this laser into any laser micromachining equipment.

Seamless User Experience

  • Easy integration.
    Remote control using REST API commands via RS232 and LAN
  • Reduced integration time.
    Demo electronics is available for laser control programming in advance
  • Easy and quick installation.
    No water, fully disconnected laser head. Can be installed by the end-user.
  • Easy troubleshooting.
    Integrated detectors and constant system status logging.
  • No periodic maintenance required.

Innovative 'Dry' Cooling System

The FemtoLux 30 laser employs an innovative cooling system and sets new reliability standards among industrial femtosecond lasers. No additional bulky and heavy water chiller is needed.

The chiller requires periodic maintenance – cooling system draining and rinsing and water and particle filter replacement. Moreover, water leakage can cause damage to the laser head and other equipment. Instead of using water for transferring heat from a laser head, the FemtoLux 30 laser uses an innovative Direct Refrigerant Cooling method.

The refrigerant agent circulates from a PSU-integrated compressor and condenser, to a cooling plate via armored flexible lines.

The entire cooling circuit is permanently hermetically sealed and requires no maintenance.

Simple & reliable cooling plate attachment

The cooling plate is detachable from the laser head for more convenient laser installation.

The laser cooling equipment is integrated with the laser power supply unit into a single 4U rack-mounted housing with a total weight of 15 kg.

Direct refrigerant cooling system features

  • Military-grade reliability
  • Permanently hermetically sealed system >90,000 hour MTBF
  • No maintenance
  • High cooling efficiency
  • >45% lower power consumption compared to water cooling equipment
  • Compact and light


ModelFemtoLux 30
Central wavelength
    Fundamental1030 nm
    With second harmonic option515 nm
Pulse Repetition Rate (PRR) 2)200 kHz – 4 MHz
Pulse repetition frequency (PRF) after frequency dividerPRF = PRR / N, N=1, 2, 3, … , 65000; single shot
Average output power
    At 1030 nm> 27 W (typical 30 W)
    At 515 nm> 11 W 3)
Pulse energy
    At 1030 nm> 90 µJ
    At 515 nm> 50 µJ 3)
Total energy in MHz/GHz burst mode> 250 µJ
Power long term stability (Std. dev.) 4)< 0.5 %
Pulse energy stability (Std. dev.) 5)< 1 %
Pulse duration (FWHM)Tunable, < 350 fs 6) – 1 ps
Beam qualityM2 < 1.2 (typical < 1.1)
Beam circularity, far field> 0.85
Beam divergence (full angle)< 1 mrad
Beam pointing thermal stability< 20 µrad/°C
Triggering modeinternal / external
Pulse output controlfrequency divider, pulse picker, burst mode, packet triggering, power attenuation
Control interfacesRS232 / LAN
Length of the umbilical cord3 m, detachable
Laser head cooling typedry (direct refrigerant cooling through detachable cooling plate)
Laser head (W × L × H)429 × 569 × 130 mm
Power supply unit (W × L × H)449 × 376 × 177 mm
Mains requirements100 – 240 V AC, single phase, 50/60 Hz
Operating ambient temperature18 – 27 °C
Relative humidity10 – 80 % (non-condensing)
Air contamination levelISO 9 (room air) or better
  1. Due to continuous improvement, all specifications are subject to change without notice. Parameters marked typical are not specifications. They are indications of typical performance and will vary with each unit we manufacture. All parameters are specified for a shortest pulse duration.
  2. When frequency divider is set to transmit every pulse. Fully controllable by integrated AOM.
  3. At 200 kHz.
  4. Over 100 h after warm-up under constant environmental conditions.
  5. Under constant environmental conditions.
  6. At PRR > 500 kHz. At PRR < 500 kHz shortest pulse duration is < 400 fs.

GHz burst option


The Femtolux 30 laser can operate in the single-pulse mode, MHz burst mode and GHz burst mode.

The burst formation technique based on the use of the AFL is a very versatile method as it allows to overcome many limitations encountered by other fiber- and/or solid-state-based techniques. The benefits of this technology:

  • Any desired intra-burst PRR can be achieved independently from the initial PRR of the master oscillator
  • Identical pulse separation inside the GHz bursts is maintained
  • Short- and long-burst formation modes can be provided. A short burst is up to about 10 ns burst width (from 2 to tens of pulses in the GHz burst). A long burst is from ~20 ns up to a few hundred ns in burst width (from tens to thousands of pulses in the GHz burst)
  • An adjustable amplitude envelope of the GHz bursts is provided
  • No pre/post pulses in GHz burst. Pure GHz bursts
  • Ultrashort pulse duration is maintained inside the bursts


A new versatile patent-pending method to form ultra-high repetition rate bursts of ultrashort laser pulses. The developed method is based on the use of an all-in-fiber active fiber loop (AFL). A detailed description of the invention can be found on:

  1. Andrejus Michailovas, and Tadas Bartulevičius. 2021 Int. patent application published under the Patent Cooperation Treaty (PCT) WO2021059003A1.
  2. Tadas Bartulevičius, Mykolas Lipnickas, Virginija Petrauskienė, Karolis Madeikis, and Andrejus Michailovas, (2022), “30 W-average-power femtosecond NIR laser operating in a flexible GHz‑burst-regime,” Opt. Express 30, 36849-36862.


Burst repetition rate200 – 650 kHz
Intra-burst pulse repetition rate 1)2 GHz
GHz BURST MODEshortlong
Number of pulses 2)2 – 2244 – 1100
Shapesquare, rising, fallingfalling, pre-shaped 3)
  1. Custom intra-pulse PRR is available upon a request.
  2. Depends on the intra-pulse PRR.
  3. For more information, please inquire sales@ekspla.com.

Short GHz burst

Long GHz burst





Found total :
1 article, 1 selected
Application selected :
All Applications
Material Processing
Glass Processing
All Applications

Femtosecond Laser Cutting of 110–550 µm Thickness Borosilicate Glass in Ambient Air and Water

Related applications:  Glass Processing Material Processing

Authors:  E. Markauskas, L. Zubauskas, G. Račiukaitis and P. Gečys

The cutting quality and strength of strips cut with femtosecond-duration pulses were investigated for different thicknesses of borosilicate glass plates. The laser pulse duration was 350 fs, and cutting was performed in two environments: ambient air and water. When cutting in water, a thin flowing layer of water was formed at the front surface of the glass plate by spraying water mist next to a laser ablation zone. The energy of pulses greatly exceeded the critical self-focusing threshold in water, creating conditions favorable for laser beam filament formation. Laser cutting parameters were individually optimized for different glass thicknesses (110–550 µm). The results revealed that laser cutting of borosilicate glass in water is favorable for thicker glass (300–550 µm) thanks to higher cutting quality, higher effective cutting speed, and characteristic strength. On the other hand, cutting ultrathin glass plates (110 µm thickness) demonstrated almost identical performance and cutting quality results in both environments. In this paper, we studied cut-edge defect widths, cut-sidewall roughness, cutting throughput, characteristic strength, and band-like damage formed at the back surface of laser-cut glass strips.

Published: 2023.   Source: Micromachines 2023, 14, 176

Application examples

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