FemtoLux 30

Industrial Femtosecond Laser
  • 30 W at 1030 nm, 11 W at 515 nm, 6 W at 343 nm
  • >90 µJ at 1030 nm, >55 µJ at 515 nm, >30 µJ at 343 nm
  • MHz, GHz, MHz+GHz burst modes
  • < 350 fs – 1 ps
  • Single shot to 4 MHz (AOM controlled)
  • Dry cooling (no water used)
  • 30 W at 1030 nm, 11 W at 515 nm, 6 W at 343 nm
  • >90 µJ at 1030 nm, >55 µJ at 515 nm, >30 µJ at 343 nm
  • MHz, GHz, MHz+GHz burst modes
  • < 350 fs – 1 ps
  • Single shot to 4 MHz (AOM controlled)
  • Dry cooling (no water used)

Features & Applications


  • Typical max output power
    30 W at 1030 nm,
    11 W at 515 nm,
    6 W at 343 nm
  • >90 µJ at 1030 nm,
    >55 µJ at 515 nm,
    >30 µJ at 343 nm
  • High energy version available (1 mJ at 10 kHz)
  • MHz, GHz, MHz+GHz burst modes
  • >250 µJ in a burst mode
  • <350 fs – 1 ps
  • Single shot to 4 MHz (AOM controlled)
  • Pulse-on-demand (PoD), with jitter as low as 20 ns (peak-to-peak)
  • <0.5% RMS power long term stability over 100 hours
  • M² < 1.2
  • Beam circularity > 0.85
  • Zero maintenance
  • Dry cooling (no water used)
  • PSU and cooling unit integrated into single 4U rack housing
  • Easy and quick installation
  • Compatible with galvo and Polygon scanners as well as PSO controllers
  • 2 years of total warranty


  • Glass, sapphire and ceramics micro processing
  • Microelectronics manufacturing
  • Glass intra volume structuring
  • Micro processing of different polymers and metals
  • LCD, LED, OLED drilling, cutting and repair


A reliable & versatile tool for micromachining

Designed from the get-go for maximum reliability, seamless integration and non-stop 24/7/365 zero maintenance operation with innovative ”dry” cooling.

The FemtoLux 30 femtosecond laser has a tunable pulse duration from <350 fs to 1 ps and can operate in a broad AOM controlled range of pulse repetition rates from a single shot to 4 MHz.

The maximum pulse energy is more than 90 μJ operating with single pulses and can reach more than 250 µJ in burst mode, ensuring higher ablation rates and processing throughput for different materials.

The FemtoLux 30 beam parameters will meet the requirements of the most demanding materials and micro-machining applications.

Innovative laser control electronics ensure simple control of the FemtoLux 30 laser by external controllers that could run on different platforms, be it Windows, Linux or others using REST API commands.

This makes easy integration and reduces the time and human resources required to integrate this laser into any laser micromachining equipment.

Seamless User Experience

  • Easy integration.
    Remote control using REST API commands via RS232 and LAN
  • Reduced integration time.
    Demo electronics is available for laser control programming in advance
  • Easy and quick installation.
    No water, fully disconnected laser head. Can be installed by the end-user.
  • Easy troubleshooting.
    Integrated detectors and constant system status logging.
  • No periodic maintenance required.

Innovative 'Dry' Cooling System

The FemtoLux 30 laser employs an innovative cooling system and sets new reliability standards among industrial femtosecond lasers. No additional bulky and heavy water chiller is needed.

The chiller requires periodic maintenance – cooling system draining and rinsing and water and particle filter replacement. Moreover, water leakage can cause damage to the laser head and other equipment. Instead of using water for transferring heat from a laser head, the FemtoLux 30 laser uses an innovative Direct Refrigerant Cooling method.

The refrigerant agent circulates from a PSU-integrated compressor and condenser, to a cooling plate via armored flexible lines.

The entire cooling circuit is permanently hermetically sealed and requires no maintenance.

Direct refrigerant cooling system features

  • Military-grade reliability
  • Permanently hermetically sealed system >90,000 hour MTBF
  • No maintenance
  • High cooling efficiency
  • >45% lower power consumption compared to water cooling equipment
  • Compact and light

Simple & reliable cooling plate attachment

The cooling plate is detachable from the laser head for more convenient laser installation.

The laser cooling equipment is integrated with the laser power supply unit into a single 4U rack-mounted housing with a total weight of 15 kg.

Easy and quick installation

  • Detachable cooling plate
  • Integrated cooling equipment with the laser power supply


ModelFemtoLux 30
Central wavelength
    Fundamental1030 nm
    With second harmonic option515 nm
    With third harmonic option343 nm
Pulse Repetition Rate (PRR) 2)200 kHz – 4 MHz
Pulse repetition frequency (PRF) after frequency dividerPRF = PRR / N, N=1, 2, 3, … , 65000; single shot
Average output power
    At 1030 nm> 27 W (typical 30 W)
    At 515 nm> 11 W 3)
    At 343 nm> 6 W 3)
Pulse energy
    At 1030 nm> 90 µJ or 1 mJ 4)
    At 515 nm> 55 µJ 3)
    At 343 nm> 30 µJ 3)
Number of pulses in MHz burst 5)2 – 10
Total energy in burst mode> 250 µJ 6)
Power long term stability (Std. dev.) 7)< 0.5 %
Pulse energy stability (Std. dev.) 8)< 1 %
Pulse duration (FWHM)Tunable, < 350 fs 9) – 1 ps 10)
Beam qualityM2 < 1.2 (typical < 1.1)
Beam circularity, far field> 0.85
Beam divergence (full angle)< 1 mrad
Beam pointing thermal stability< 20 µrad/°C
Beam diameter (1/e2) at 20 cm distance from laser aperture at 1030 nm2.5 ± 0.4 mm
Triggering modeinternal / external
Pulse output controlfrequency divider, pulse picker, burst mode, packet triggering, power attenuation, pulse-on-demand 11)
Control interfacesRS232 / LAN
Length of the umbilical cord3 m, detachable
Laser head cooling typedry (direct refrigerant cooling through detachable cooling plate)
Laser head (W × L × H)429 × 569 × 130 mm
Power supply unit (W × L × H)449 × 376 × 177 mm
Mains requirements100 – 240 V AC, single phase, 50/60 Hz
Operating ambient temperature18 – 27 °C
Relative humidity10 – 80 % (non-condensing)
Air contamination levelISO 9 (room air) or better
  1. Due to continuous improvement, all specifications are subject to change without notice. Parameters marked typical are not specifications. They are indications of typical performance and will vary with each unit we manufacture. All parameters are specified for a shortest pulse duration.
  2. When frequency divider is set to transmit every pulse. Fully controllable by integrated AOM.
  3. At 200 kHz.
  4. At 10 kHz, fixed pulse duration (for example 1 ps).
  5. Oscillator frequency ~50 MHz, ~20 ns separation between pulses.
  6. > 250 µJ in MHz burst mode or MHz+GHz burst mode at 100 kHz PRR. > 90 µJ energy in GHz burst mode.
  7. Over 100 h after warm-up under constant environmental conditions.
  8. Under constant environmental conditions.
  9. At PRR > 500 kHz. At PRR < 500 kHz shortest pulse duration is < 400 fs.
  10. Custom pulse duration by request. For example – fixed 50 fs available.
  11. Jitter < 20 ns. Trigger-to-pulse delay < 1 µs.

GHz burst option

The Femtolux 30 laser can operate in the single-pulse mode, MHz burst mode and GHz burst mode.

The burst formation technique based on the use of the AFL is a very versatile method as it allows to overcome many limitations encountered by other fiber- and/or solid-state-based techniques.


  • Any desired intra-burst PRR can be achieved independently from the initial PRR of the master oscillator
  • Identical pulse separation inside the GHz bursts is maintained
  • Short- and long-burst formation modes can be provided.
    – A short burst is up to about 10 ns burst width (from 2 to tens of pulses in the GHz burst).
    – A long burst is from ~20 ns up to a few hundred ns in burst width (from tens to thousands of pulses in the GHz burst)
  • MHz+GHz burst mode
  • An adjustable amplitude envelope of the GHz bursts is provided
  • No pre/post pulses in GHz burst. Pure GHz bursts
  • Ultrashort pulse duration is maintained inside the bursts


A new versatile patent-pending method to form ultra-high repetition rate bursts of ultrashort laser pulses. The developed method is based on the use of an all-in-fiber active fiber loop (AFL). A detailed description of the invention can be found on:

  1. Andrejus Michailovas, and Tadas Bartulevičius. 2021 Int. patent application published under the Patent Cooperation Treaty (PCT) WO2021059003A1.
  2. Tadas Bartulevičius, Mykolas Lipnickas, Virginija Petrauskienė, Karolis Madeikis, and Andrejus Michailovas, (2022), “30 W-average-power femtosecond NIR laser operating in a flexible GHz‑burst-regime,” Opt. Express 30, 36849-36862.


Burst repetition rate200 – 650 kHz
Intra-burst pulse repetition rate 1)2 GHz
GHz BURST MODEshortlong
Number of pulses 2)2 – 2244 – 1100
Shapesquare, rising, fallingfalling, pre-shaped 3)
Burst repetition rate100 – 650 kHz
Number of pulses in MHz burst2 – 10
Number of pulses in GHz burst2 – 22
  1. Custom intra-pulse PRR is available upon a request.
  2. Depends on the intra-pulse PRR.
  3. For more information, please inquire sales@ekspla.com.

Short GHz burst

Long GHz burst

MHz + GHz burst mode

Pulse-on-Demand (PoD)


  • Jitter lower than 20 ns ensures consistent and equidistant pulse spacing for high-speed micromachining
  • Adjustable repetition rate for processing complex geometries
  • Faster processing speeds, increased productivity

PoD feature enables the laser to fire a pulse only when required, rather than at a constant rate, enabling precise control over the laser’s output and resulting in higher efficiency, accuracy and quality.

This capability is especially valuable in various micromachining applications where a high processing speed, constant energy, and accuracy are essential. To follow complex curvature at high speed and to maintain equidistant spacing it is necessary to ensure that the repetition rate of the pulses is adjusted. To achieve these requirements, it is necessary to ensure that the repetition rate of the pulses is adjusted to follow complex curvature at high speed and to maintain equidistant spacing. One may try to use position based laser triggering but, due to laser system limitations, the jitter will be from several μs to tens of μs, which will result in random spacing of the pulses. On the other hand, the usage of time based laser triggering results in overheat areas, due to excessive overlap of pulses. The FemtoLux 30 laser has the pulse-on-demand feature with jitter as low as 20 ns (peak-to-peak), and it can therefore tackle all the challenges and maximize process efficiency, precision and quality at high speed.

Traditional laser triggering techniques struggle to maintain equally spaced pulses at high speeds (Fig.1, 2). Pulse-on-demand feature tackles this challenge and enables high-speed micromachining (Fig. 3).





Found total :
1 article, 1 selected
Application selected :
All Applications
Material Processing
Glass Processing
All Applications

Femtosecond Laser Cutting of 110–550 µm Thickness Borosilicate Glass in Ambient Air and Water

Related applications:  Glass Processing Material Processing

Authors:  E. Markauskas, L. Zubauskas, G. Račiukaitis and P. Gečys

The cutting quality and strength of strips cut with femtosecond-duration pulses were investigated for different thicknesses of borosilicate glass plates. The laser pulse duration was 350 fs, and cutting was performed in two environments: ambient air and water. When cutting in water, a thin flowing layer of water was formed at the front surface of the glass plate by spraying water mist next to a laser ablation zone. The energy of pulses greatly exceeded the critical self-focusing threshold in water, creating conditions favorable for laser beam filament formation. Laser cutting parameters were individually optimized for different glass thicknesses (110–550 µm). The results revealed that laser cutting of borosilicate glass in water is favorable for thicker glass (300–550 µm) thanks to higher cutting quality, higher effective cutting speed, and characteristic strength. On the other hand, cutting ultrathin glass plates (110 µm thickness) demonstrated almost identical performance and cutting quality results in both environments. In this paper, we studied cut-edge defect widths, cut-sidewall roughness, cutting throughput, characteristic strength, and band-like damage formed at the back surface of laser-cut glass strips.

Published: 2023.   Source: Micromachines 2023, 14, 176

Material processing examples

Transparent materials

Transparent materials, such as glass/sapphire are fascinating materials with remarkable properties that have made it a favorite among researchers and engineers for decades. Its robustness, chemical resistance, transparency, and affordability have made it an ideal candidate for a multitude of applications, ranging from microfluidic devices and optical components to electronic devices.

The femtosecond laser micromachining technique has brought transparent materials processing to the next level. Complex structures can now be precisely fabricated by selectively removing material through drilling, cutting, and milling.


Polymers are revolutionizing various industries with their exceptional properties, including flexibility, durability, and ease of processing. These versatile materials find application in a wide range of fields, from aerospace and biomedicine to electronics.

Polymer processing with femtosecond lasers has opened up new avenues for precision fabrication of complex structures by selectively removing polymer with high precision and minimal thermal effects.

Femtosecond laser processing can also be used for photo-polymerization, a process where monomers or prepolymers are selectively polymerized to create complex 3D structures with sub-micron resolution, high accuracy, and repeatability.


Metals, particularly stainless steel, has become an integral part of modern engineering and manufacturing thanks to its mechanical, chemical, and aesthetic properties. Its versatility has led to its use in diverse fields such as aerospace, automotive, architecture, and medical equipment.

Femtosecond laser technology has revolutionized metal micromachining, offering an exciting array of possibilities for creating visually stunning and intricately precise structures with minimal heat affected zones. Femtosecond lasers enable the production of complex shapes and features, while also providing the capability to perform black/white marking and coloring without the need for chemical additives.

Other materials

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