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Warranty

...products that do not require installation commences from the date of shipment, unless the product has been returned to Ekspla due to product damage during transportation. In that case, the warranty period commences on the date of repeated shipment. If the laboratory does not meet the required conditions, the service...

LIDAR

...NL300 Compact Flash-lamp Pumped Q-switched Nd:YAG Lasers Compact high energy nanosecond lasers Up to 1100 mJ Up to 213 nm harmonics modules Motorized attenuators 5 – 20 Hz pulse repetition rates NT230 High Energy Broadly Tunable DPSS Lasers Integrated OPO system Diode pumped Ultrabroad tuning range from 192 to 2600 nm Up to 15 mJ in...

Hybrid laser processing of micro-lens arrays

...the sample, so ablation debris leaves through the backside and high aspect ratio geometries can be formed in glass. A micro-lens array was fabricated with hybrid laser processing: burst mode combined with bottom-up milling. The device base was first cut from a thick fused-silica plate, the lens array was then...

Laser-based Bessel beam scribing

Laser-based Bessel beam scribing Bessel beam scribing is the most efficient laser-based, kerf-free method for scribing glass. The technique introduces intra-volume voids, and the glass is then separated mechanically or thermally. Sidewalls come out smooth, and because only a single laser pass is required, scribing speeds are high. A FemtoLux...

Photolysis

Photodissociation, photolysis, or photodecomposition is a chemical reaction in which a chemical compound is broken down by photons. It is defined as the interaction of one or more photons with one target molecule. Photolysis plays an important role in photosynthesis, during which it produces energy by splitting water molecules into...

Technical support

Support Headquarters Branches Representatives Technical support Contact Support Not found Contact Support Technical support FOR SCIENTIFIC CUSTOMERS Support Phone: +370 5 264 9623 E-mail: service@ekspla.com Spare parts E-mail: spares@ekspla.com FOR OEM AND INDUSTRIAL CUSTOMERS Support and spare parts Phone: +370 5 264 9623 E-mail: support@ekspla.com SERVICE DEPARTMENT ADDRESS Savanoriu Av. 237, LT-02300 Vilnius,...

Support

Support Technical support Warranty Terms Sales Conditions Privacy Policy Contact Support Not found Contact Support Technical support FOR SCIENTIFIC CUSTOMERS Support Phone: +370 5 264 9623 E-mail: service@ekspla.com Spare parts E-mail: spares@ekspla.com FOR OEM AND INDUSTRIAL CUSTOMERS Support and spare parts Phone: +370 5 264 9623 E-mail: support@ekspla.com SERVICE DEPARTMENT ADDRESS Savanoriu Av....

Cutting of various metals

Cutting of various metals Femtosecond pulses end before heat can diffuse into the surrounding metal, so metals are cut with no burrs, a minimal heat-affected zone and high precision. Thin metal foils in particular can be given complex shapes and fine features. FemtoLux has been used to cut stainless steel,...

Femtosecond laser cutting of FZ-Si wafer

The production of complex and customized optoelectronic devices and components often necessitates specifically shaped and milled chips. Traditional mechanical approaches usually end up in having limitations. They are restricted in shape due to the material’s tendency to cleave along specific crystallo- graphic directions, and they offer limited control over the...

Bottom-up milling of glass

...through the backside and high aspect ratio geometries can be formed in glass. The FemtoLux GHz burst function combined with bottom-up milling raises process throughput. Precise, flexible control of the burst energy and the number of pulses in the burst sets the thermal stress generated in the glass substrate. With...