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Femtosecond laser cutting of FZ-Si wafer
The production of complex and customized optoelectronic devices and components often necessitates specifically shaped and milled chips. Traditional mechanical approaches usually end up in having limitations. They are restricted in shape due to the material’s tendency to cleave along specific crystallo- graphic directions, and they offer limited control over the...
Bottom-up milling of glass
...through the backside and high aspect ratio geometries can be formed in glass. The FemtoLux GHz burst function combined with bottom-up milling raises process throughput. Precise, flexible control of the burst energy and the number of pulses in the burst sets the thermal stress generated in the glass substrate. With...
Glass
...so all ablation products leave through the backside and deep, taper-free geometries can be formed in glass. Hybrid laser processing of micro-lens arrays A micro-lens array is fabricated with hybrid laser processing: burst mode combined with bottom-up milling. The device base is cut from a thick fused-silica plate, the lens...
Polymer
...the heat spreads, so cuts come out clean. Focused inside a resin, the same pulses solidify it point by point into 3D structures. Cutting and milling of polymers with no melting or charring, and photopolymerization of 3D parts white blur Processing of polymer Femtosecond lasers, with their very short pulse...
Products
...rates Femtosecond, picosecond & nanosecond pulse durations Excellent beam quality Wide range of customization possibilities High Intensity Systems Femtosecond, picosecond & nanosecond pulse durations From single shot to kHz repetition rates Custom laser systems that enable customer to perform complex experiments Laser Spectroscopy & Imaging Photoacoustic imaging laser sources Sum...
Femtosecond laser-induced selective etching
...of nanometers. A FemtoLux supplies the pulses for both examples here. A movable bistable switch was made in fused silica with 20 µm arm widths, and through-glass vias of various diameters were etched taper-free in the same material. One comes from micromechanics, the other from semiconductor fabrication. Manufacturing examples Femtosecond...
Thin glass cutting
...glass type, so one system covers borosilicate, fused silica and thin cover slips. Cut edges, milled features and 300 µm drilled holes all come out with minimal chipping and no cracking. 300 µm hole drilling in thin borosilicate glass. Courtesy of FTMC. Manufacturing examples Scanning electron microscope image of drilled...
Laser spectroscopy
...a chemical reaction in which a chemical compound is broken down by photons. SFG spectroscopy Sum frequency generation vibrational spectroscopy (SFG-VS) is used to characterize vibrational bonds of molecules at surfaces or interfaces. SHG spectroscopy / microscopy SHG measurements provide information about: surface coverage, molecular orientation, adsorbtion-desorbtion processes, and reactions...
Photopolymerization
...with almost no constraint on geometry or wall thickness. FemtoLux 3 suits this work. It is a compact, low-power fiber laser whose 300 fs pulses are short enough to drive two-photon absorption, so solidification stays inside the focal volume. With 3 W of average power and a repetition rate up...
Femtosecond processing of GaAs in ambient air and water environment
Processing semiconductor materials such as Gallium Arsenide (GaAs) using ultrashort laser pulses presents unique challenges due to heat accumulation and the need for precise, high-quality modifications. Femtosecond lasers are particularly well-suited for this task, offering minimal thermal impact and high precision. In a comprehensive study, the ablation of GaAs was...