Segregation of an amine component in a model epoxy resin at a copper interface

We have studied the chemical composition of the epoxy and amine components, HDGEBA and CBMA, of an epoxy resin in close proximity to a copper interface by using ADXPS in conjunction with SFG vibrational spectroscopy. A bilayer sample of epoxy resin and copper was first prepared on a solid substrate before etching the copper layer just before the interface with Ar+ beams. Using ADXPS, in which an incident X-ray was guided from the copper surface, it was found that the CBMA component was preferentially segregated at the copper interface, with the segregation extending over ~10 nm. SFG spectroscopy was used to confirm the above observation. Postulating that copper ions diffused from the metal copper into the internal phase during the curing process and reacted with amine groups to form copper complexes, the interfacial segregation of CBMA can be understood. This knowledge should be useful for understanding and controlling the adhesive properties of epoxy resins.