Sapphire Stealth Dicing

Single crystal sapphire offers superior physical, chemical, and optical properties, which make it an excellent material for wide range of applications. However, the high cost of sapphire machining precludes its use in all but the highest value applications. Stealth dicing technique using Atlantic 6 laser is a solution that ensures the best quality and cost minimization. Using this method, laser induced modifications are created inside the volume of sapphire without damaging the top and bottom surfaces of the substrate, even in thick wafers. The modifications create a crack plane and sapphire is cleaved by applying external force, resulting in a clean process with almost no material loses because of effectively zero kerf width. Some applications include: high-speed integrated circuit chips, thin-film GaN-based light emitting diode substrates, wristwatch crystals and movement bearings, scratch resistant display and camera covers, and high durability optical windows for extreme applications.

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Industrial Lasers
Atlantic series – high power industrial picosecond lasers

Multi-photon absorption enhancement by dual-wavelength double-pulse laser irradiation for efficient dicing of sapphire wafers

Related products:  Atlantic series

Authors:  M. Gedvilas, J. Mikšys, J. Berzinš, V. Stankevič, G. Račiukaitis

The evidence of multi-photon absorption enhancement by the dual-wavelength double-pulse laser irradiation in transparent sapphire was demonstrated experimentally and explained theoretically for the first time. Two collinearly combined laser beams with the wavelengths of 1064 nm and 355 nm, inter-pulse delay of 0.1 ns, and pulse duration of 10 ps were used to induce intra-volume modifications in sapphire. The theoretical prediction of using a particular orientation angle of 15 degrees of the half-wave plate for the most efficient absorption of laser irradiation is in good agreement with the experimental data. The new innovative effect of multi-photon absorption enhancement by dual-wavelength double-pulse irradiation allowed utilisation of the laser energy up to four times more efficiently for initiation of internal modifications in sapphire. The new absorption enhancement effect has been used for efficient intra-volume dicing and singulation of transparent sapphire wafers. The dicing speed of 150 mm/s was achieved for the 430 μm thick sapphire wafer by using the laser power of 6.8 W at the repetition rate of 100 kHz. This method opens new opportunities for the manufacturers of the GaN-based light-emitting diodes by fast and precise separation of sapphire substrates.

Published: 2017.   Source: Scientific Reports, 7, 5218 (2017)
Metal Black/Color Marking

Medical tools and other devices made of stainless steel (SS) require laser markings for unique device identification (UDI). These markings need to be corrosion resistant in order to withstand numerous autoclave cycles. The Atlantic 6 laser shows excellent results in color modifications of stainless steel. The shade of stainless steel can be lightened or darkened by controlling laser power and scanning speed of the beam. The resistance of the laser marked areas to the corrosion was tested by using the salt spray test according to the international standard (ISO 9227), and the marking can withstand extreme environmental conditions, and is absolutely rust-proof.

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Industrial Lasers
Atlantic series – high power industrial picosecond lasers

Corrosion Resistive Laser Marking of Stainless Steel by Atlantic Series Picosecond Laser

Related products:  Atlantic series

Authors:  M. Gedvilas, G, Račiukaitis

Medical tools and other devices made of stainless steel (SS) require laser markings for unique device identification (UDI). These markings need to be corrosion resistant in order to withstand numerous autoclave cycles. EKSPLA with FTMC has developed a picosecond laser marking system – for reliable UDI marks on surgical and spring grade of stainless steel for corrosion resistive applications.

Published: 2017.   Source: Ekspla Application notes.
Glass Processing
Laser milling Laser milling

The glass is an important engineering material for a number of different applications. Laser machining of transparent materials, such as flat glass, is a fast growing market, driven by new developments in displays, optoelectronics and medical device technology. Conventional glass processing techniques such as diamond drilling and dicing, water-jet drilling, sand blasting or ultrasonic processing are still commonly used in mass production, although limitations of these techniques in flexibility, processing speed and quality require a search for novel technological solutions. Laser-based techniques such as rear side glass processing can offer high quality and throughput, which can be used for glass drilling, cutting and milling applications. Typical kerf widths with such technique can be extremely reduced compared to mechanical diamond tool processing. Therefore, laser milled feature sizes can be reduced to 150 µm. Furthermore, laser cuts are taper–less, therefore, extremely high aspect ratio features can be fabricated. Glass surface chipping during processing is another important issue. However, laser-based processing with Atlantic series picosecond laser can maintain high throughput with the highest processing quality keeping surface chipping bellow 100 µm.

  • Materials: soda lime glass (SLG), fused silica, BK7 glass, borosilicate glass;
  • Quality: Surface chipping <100 µm, sidewall roughness <2 µm;
  • Cutting throughput: 0.6 m/min (1 mm SLG glass), 0.12 m/min (5 mm SLG glass);
  • Via drilling Ø 0.2-1 mm: 1 s/via (1 mm SLG), 5 s/via (5 mm SLG);
  • Material removal rate: 90 mm3/min.

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Industrial Lasers
Atlantic series – high power industrial picosecond lasers

Glass dicing with elliptical Bessel beam

Related products:  Atlantic series

Authors:  J. Dudutis, R. Stonys, G. Račiukaitis, P. Gečys

In this paper the possibility to optimize the glass dicing process by controlling the axicon-generated Bessel beam ellipticity is presented. Single-shot intra-volume modifications in soda-lime glass followed by dicing experiments of 1 mm-thick samples are performed. The Bessel beam ellipticity is essential for glass dicing process. Such beam generates intra-volume modifications with transverse crack propagation in dominant direction. Orientation of these modifications parallel to the dicing direction gives significant advantages in terms of processing speed, glass breaking force and cutting quality.

Published: 2019.   Source: Optics & Laser Technology, 111, 331-337 (2019)